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PX3511A, PX3511B
Absolute Maximum Ratings
Thermal Information
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Thermal Resistance
θ JA (°C/W)
θ JC (°C/W)
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V BOOT ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36V
Input Voltage (V PWM ) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . . . . . . . . . . . . . . V PHASE - 0.3V DC to V BOOT + 0.3V
V PHASE - 3.5V (<100ns Pulse Width, 2μJ) to V BOOT + 0.3V
LGATE . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V DC to V PVCC + 0.3V
SOIC Package (Note 1) . . . . . . . . . . . . 100 N/A
DFN Package (Notes 2, 3) . . . . . . . . . . 48 7
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
GND - 5V (<100ns Pulse Width, 2μJ) to V PVCC + 0.3V
PHASE. . . . . . . . . . . . . . . GND - 0.3V DC to 15V DC (V PVCC = 12V)
GND - 8V (<400ns, 20μJ) to 30V (<200ns, VBOOT-GND<36V)
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . . . 0°C to +85°C
Maximum Operating Junction Temperature . . . . . . . . . . . . . +125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V ± 10%
Supply Voltage Range, PVCC . . . . . . . . . . . . . . . . 5V to 12V ± 10%
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. θ JA is measured with the component mounted on a high effective thermal conductivity test board in free air.
2. θ JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
Tech Brief TB379.
3. For θ JC , the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
Recommended Operating Conditions, Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Bias Supply Current
Gate Drive Bias Current
I VCC
I VCC
I PVCC
I PVCC
(Note 4)
PX3511A, f PWM = 300kHz, V VCC = 12V
PX3511B, f PWM = 300kHz, V VCC = 12V
PX3511A, f PWM = 1MHz, V VCC = 12V
PX3511B, f PWM = 1MHz, V VCC = 12V
PX3511A, f PWM = 300kHz, V PVCC = 12V
PX3511B, f PWM = 300kHz, V PVCC = 12V
PX3511A, f PWM = 1MHz, V PVCC = 12V
PX3511B, f PWM = 1MHz, V PVCC = 12V
-
-
-
-
-
-
-
-
8
4.5
10.5
5
4
7.5
5
8.5
-
-
-
-
-
-
-
-
mA
mA
mA
mA
mA
mA
mA
mA
POWER-ON RESET AND ENABLE
VCC Rising Threshold
VCC Falling Threshold
9.35
7.35
9.8
7.6
10.0
8.0
V
V
PWM INPUT (See Timing Diagram on Page 6)
Input Current
PWM Rising Threshold (Note 4)
PWM Falling Threshold (Note 4)
Typical Three-State Shutdown Window
Three-State Lower Gate Falling Threshold
Three-State Lower Gate Rising Threshold
Three-State Upper Gate Rising Threshold
I PWM
V PWM = 3.3V
V PWM = 0V
VCC = 12V
VCC = 12V
VCC = 12V
VCC = 12V
VCC = 12V
VCC = 12V
-
-
-
-
1.23
-
-
-
505
-460
1.70
1.30
-
1.18
0.76
2.36
-
-
-
-
1.82
-
-
-
μA
μA
V
V
V
V
V
V
4
FN6462.0
February 26, 2007
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